- 专利标题： Wire processing apparatus
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申请号： US16026584申请日： 2018-07-03
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公开(公告)号： US10933460B2公开(公告)日： 2021-03-02
- 发明人: Yingcong Deng , Lan Gong , Qian Ying , Dandan Zhang , Lvhai Hu , Yun Liu , Qinglong Zeng , Yong Yan , Roberto Francisco-Yi Lu
- 申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co. Ltd
- 申请人地址： CN Shanghai; US PA Berwyn; CN Chengdu; CN Shenzhen
- 专利权人： Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation,Measurement Specialties (Chengdu) Ltd.,Shenzhen AMI Technology Co. Ltd
- 当前专利权人： Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation,Measurement Specialties (Chengdu) Ltd.,Shenzhen AMI Technology Co. Ltd
- 当前专利权人地址： CN Shanghai; US PA Berwyn; CN Chengdu; CN Shenzhen
- 代理机构： Barley Snyder
- 优先权： CN201710538400.1 20170704
- 主分类号： B23P19/00
- IPC分类号： B23P19/00 ; B21F1/02
摘要：
A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.
公开/授权文献
- US20190009326A1 Wire Processing Apparatus 公开/授权日：2019-01-10
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