A sensor assembly includes first and second sensor packages adjacent to one another and directly overmolded with an overmold material without being attached to a carrier structure. The first sensor package includes a first sensor die, a first set of connector pins electrically connected to the first sensor die, a first housing in which the first sensor die is located, the first housing having first and second surfaces spaced apart from one, and a first component positioned in proximity to the second surface of the first housing. The second sensor package includes a second sensor die, a second set of connector pins electrically connected to the second sensor die, a second housing in which the second sensor die is located, the second housing having third and fourth surfaces spaced apart from one another, and a second component positioned in proximity to the fourth surface of the second housing.