Invention Grant
- Patent Title: High voltage device and manufacturing method thereof
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Application No.: US16354140Application Date: 2019-03-14
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Publication No.: US10943978B2Publication Date: 2021-03-09
- Inventor: Tsung-Yi Huang
- Applicant: RICHTEK TECHNOLOGY CORPORATION
- Applicant Address: TW Zhubei
- Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee Address: TW Zhubei
- Agency: Tung & Associates
- Priority: TW107122345 20180628
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/66 ; H01L29/40 ; H01L21/74

Abstract:
An N-type high voltage device includes: a semiconductor layer, a well region, a floating region, a bias region, a body region, a body contact, a gate, a source and a drain. The floating region and the bias region both have P-type conductivity, and both are formed in a drift region in the well region. The bias region is electrically connected with a predetermined bias voltage, and the floating region is electrically floating, to increase a breakdown voltage of the high voltage device and to suppress turning-ON a parasitic transistor in the high voltage device.
Public/Granted literature
- US20200006490A1 HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-01-02
Information query
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