A micro-LED transfer method and manufacturing method. The micro-LED (303) transfer method comprises: bringing pickup units (305) of a transfer head in contact with micro-LEDs (303) on a carrier substrate (301), wherein the pickup units (305) are able to apply current to the micro-LEDs (303); applying current to the micro-LEDs (303) via the pickup units (305) to heat up bonding layers (302) between the micro-LEDs (303) and the carrier substrate (301) to be melted; picking up the micro-LEDs (303) from the carrier substrate (301) with the transfer head; bonding the micro-LEDs (303) onto a receiving substrate (307); and removing the transfer head from the micro-LEDs.