发明授权
- 专利标题: LED light bulb having filament with conductive section providing with rivet structure
-
申请号: US16576810申请日: 2019-09-20
-
公开(公告)号: US10944028B2公开(公告)日: 2021-03-09
- 发明人: Tao Jiang , Weihong Xu , Yukihiro Saito , Hayato Unagike , Aiming Xiong , Junfeng Xu , Yiching Chen
- 申请人: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- 申请人地址: CN Jiaxing
- 专利权人: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- 当前专利权人: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- 当前专利权人地址: CN Jiaxing
- 代理商 Simon Kuang Lu
- 优先权: CN201711434993.3 20171226,CN201711477767.3 20171229,CN201810031786.1 20180112,CN201810065369.9 20180123,CN201810343825.1 20180417,CN201810344630.9 20180417,CN201810498980.0 20180523,CN201810501350.4 20180523,CN201810573314.9 20180606,CN201810836433.9 20180726,CN201810943054.X 20180817,CN201811005145.5 20180830,CN201811005536.7 20180830,CN201811079889.1 20180917,CN201811277980.4 20181030,CN201811285657.1 20181031,CN201811378173.1 20181119,CN201811378189.2 20181119,CN201811549205.X 20181218
- 主分类号: H01L33/50
- IPC分类号: H01L33/50 ; H01L33/62 ; H01L25/075 ; F21K9/237
摘要:
An LED light bulb, comprising of: a lamp housing; a bulb base connected to the lamp housing; a stem connected to the bulb base and located in the lamp housing, the stem comprises a stand extending to the center of the lamp housing; a single LED filament, disposed in the lamp housing, the LED filament comprising: a plurality of LED sections, each of the LED sections includes at least two LED chips that are electrically connected to each other; a plurality of conductive sections, each of the conductive sections is located between the two adjacent LED sections and configured to electrically connect the two adjacent LED sections, each of the conductive sections includes at least one conductor that connects the two adjacent LED sections, each of the conductor has at least one through hole; a light conversion layer comprising a base layer and a top layer, wherein the base layer of the light conversion layer is filled into the through hole of the conductor and then contacting the surface of the top layer.
公开/授权文献
信息查询
IPC分类: