Invention Grant
- Patent Title: Electronic device with relay mounted to substrate
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Application No.: US16007017Application Date: 2018-06-13
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Publication No.: US10945336B2Publication Date: 2021-03-09
- Inventor: Ronald Martin Weber
- Applicant: TE CONNECTIVITY CORPORATION
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H01H50/04 ; H01L23/50

Abstract:
An electronic device includes a substrate having a top surface, a bottom surface and at least one opening therethrough. The substrate has circuitry. A relay is mounted to the substrate and is electrically connected to the circuitry. The relay has a switching device configured to activate the relay. The switching device has contacts electrically connected to the circuitry. The relay is mounted to the substrate in the opening such that at least a portion of the switching device is positioned above the top surface and at least a portion of the switching device is positioned below the top surface.
Public/Granted literature
- US20190387627A1 ELECTRONIC DEVICE WITH RELAY MOUNTED TO SUBSTRATE Public/Granted day:2019-12-19
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