- 专利标题: Techniques for making hermetic feedthroughs for enclosures
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申请号: US16708171申请日: 2019-12-09
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公开(公告)号: US10945347B2公开(公告)日: 2021-03-09
- 发明人: Phillip Solomon , Kai Hudek , Jason Madjdi Amini
- 申请人: IonQ, Inc.
- 申请人地址: US MD College Park
- 专利权人: IonQ, Inc.
- 当前专利权人: IonQ, Inc.
- 当前专利权人地址: US MD College Park
- 代理机构: Arent Fox
- 主分类号: H05K5/06
- IPC分类号: H05K5/06 ; H05K5/00 ; H01R25/00 ; H05K1/18
摘要:
The disclosure describes various aspects of techniques that can be used for making hermetic feedthroughs for enclosures. For example, a panel that provides a hermetic seal to a system enclosure can include an enclosure board made of a printed circuit board (PCB) and configured to have a size and shape that precisely covers an access to the system enclosure, the enclosure board including multiple inner connectors on an inner side of the PCB facing the inside of the system enclosure and multiple outer connectors on an outer side of the PCB facing the outside the system enclosure for feeding one or more of signals or fluids (e.g., gases, liquids, vacuum) through the PCB by having inner and outer connectors connected through the PCB. The panel may further include a gasket fitting the size and shape of the enclosure board and used with the enclosure board to provide the hermetic seal.
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