A front camera module includes a camera and a substrate, and the camera is mounted on one surface (camera mounting surface) of the substrate. A rear camera module includes a camera and a substrate, and the camera is mounted on one surface (camera mounting surface) of the substrate. An IC mounting surface of the substrate of the front camera module and an IC mounting surface of the substrate of the rear camera module are opposed to each other in a front-and-rear direction. The camera of the rear camera module is oriented in a direction opposite to the camera of the front camera module. Moreover, a camera assembly includes a cooling fan configured to send air to a region between the two substrates. With this structure, temperature of the camera modules is prevented from exceeding an allowable operation temperature that has been defined in advance.