- 专利标题: Semiconductor device and method
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申请号: US16567053申请日: 2019-09-11
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公开(公告)号: US10957604B2公开(公告)日: 2021-03-23
- 发明人: Shih-Chieh Wu , Pang-Chi Wu , Kuo-Yi Chao , Mei-Yun Wang , Hsien-Huang Liao , Tung-Heng Hsieh , Bao-Ru Young
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/82
- IPC分类号: H01L21/82 ; H01L21/76 ; H01L21/8234 ; H01L29/66 ; H01L21/768
摘要:
In an embodiment, a method includes: forming a first fin extending from a substrate; forming a second fin extending from the substrate, the second fin being spaced apart from the first fin by a first distance; forming a metal gate stack over the first fin and the second fin; depositing a first inter-layer dielectric over the metal gate stack; and forming a gate contact extending through the first inter-layer dielectric to physically contact the metal gate stack, the gate contact being laterally disposed between the first fin and the second fin, the gate contact being spaced apart from the first fin by a second distance, where the second distance is less than a second predetermined threshold when the first distance is greater than or equal to a first predetermined threshold.
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