- 专利标题： Method for fabricating a semiconductor and semiconductor package
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申请号： US16839404申请日： 2020-04-03
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公开(公告)号： US10957671B2公开(公告)日： 2021-03-23
- 发明人: Gottfried Beer , Irmgard Escher-Poeppel
- 申请人： Intel Deutschland GMBH
- 申请人地址： DE Neubiberg
- 专利权人： Intel Deutschland GMBH
- 当前专利权人： Intel Deutschland GMBH
- 当前专利权人地址： DE Neubiberg
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L21/768
摘要：
A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.
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