Invention Grant
- Patent Title: Low-profile multi-band hyperspectral imaging for machine vision
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Application No.: US16582705Application Date: 2019-09-25
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Publication No.: US10962858B2Publication Date: 2021-03-30
- Inventor: Xiaoping Hong , Mingyu Wang , Huai Huang
- Applicant: SZ DJI TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SZ DJI TECHNOLOGY CO., LTD.
- Current Assignee: SZ DJI TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: G03B11/00
- IPC: G03B11/00 ; G06T7/55 ; G02B26/00 ; G02B5/20 ; H04N5/225 ; H04N5/247 ; H04N5/265 ; G03B15/00

Abstract:
A novel imaging system is provided for capturing imaging data. According to the disclosed embodiments, the imaging system comprises one or more cameras configured to capture the same scene within each camera's field of view. The imaging system also includes a plurality of bandpass filters that may be positioned in front of one or more cameras. Each bandpass filter may allow the transmission of incident electromagnetic signals between different pairs of first and second wavelengths. Accordingly, when the bandpass filters are positioned in front of the one or more cameras, each camera captures a different spectral image, i.e., containing only certain frequency components of the same scene being imaged in the cameras. The bandpass filters may be selectively aligned with one or more cameras by rotating and/or translating the filters relative to the cameras' positions in the imaging system.
Public/Granted literature
- US20200019039A1 LOW-PROFILE MULTI-BAND HYPERSPECTRAL IMAGING FOR MACHINE VISION Public/Granted day:2020-01-16
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