- 专利标题: Electronic device and assembling method of electronic device
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申请号: US16453997申请日: 2019-06-26
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公开(公告)号: US10963021B2公开(公告)日: 2021-03-30
- 发明人: Chin-Hsien Chang , Yen-Chia Chang
- 申请人: Chin-Hsien Chang , Yen-Chia Chang
- 申请人地址: TW Taipei; TW Taipei
- 专利权人: Chin-Hsien Chang,Yen-Chia Chang
- 当前专利权人: Chin-Hsien Chang,Yen-Chia Chang
- 当前专利权人地址: TW Taipei; TW Taipei
- 代理机构: JCIPRNET
- 主分类号: G06F1/16
- IPC分类号: G06F1/16 ; G06F3/16 ; G06F3/041
摘要:
An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.
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