- 专利标题： Integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA)
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申请号： US16142448申请日： 2018-09-26
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公开(公告)号： US10964561B2公开(公告)日： 2021-03-30
- 发明人: Michael R. Arneson , William R. Bandy
- 申请人： Matrics2, Inc.
- 申请人地址： US MN Warba
- 专利权人： Matrics2, Inc.
- 当前专利权人： Matrics2, Inc.
- 当前专利权人地址： US MN Warba
- 代理机构： Fiala & Weaver P.L.L.C.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/67 ; H01L23/00 ; H01L21/683 ; H01L23/544
摘要：
Methods, systems, and apparatuses are described for integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) printing to achieve very high resolution manufacturing to meet the precision tolerances required for very small IC die sizes.