- 专利标题: Semiconductor package and method of fabricating the same
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申请号: US16696759申请日: 2019-11-26
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公开(公告)号: US10964643B2公开(公告)日: 2021-03-30
- 发明人: Kyoung Lim Suk , Seokhyun Lee
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Muir Patent Law, PLLC
- 优先权: KR10-2017-0101832 20170810
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L23/538 ; H01L23/14 ; H01L23/00 ; H01L25/10 ; H01L25/00 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L21/683
摘要:
Insulating layers of a redistribution layer of a semiconductor package may be formed as a polymer film having inorganic fillers formed therein. The inorganic fillers may trap reactive materials to inhibit and/or substantially prevent the metal conductors, such as chip pads of the semiconductor chip being packaged, from being damaged by the reactive material. As a result, the reliability and the durability of the semiconductor package may be improved.
公开/授权文献
- US20200098694A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 公开/授权日:2020-03-26