The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.