A method, comprises: providing a laminar support member, having a front surface, arranging on the front surface at least one semiconductor die having a front surface and a back surface, with the back surface thereof towards the front surface of the support member and with the front surface thereof having die pads, arranging at the front surface of the support member sidewise of the at least one semiconductor die a plurality of electrically-conductive bodies, the electrically-conductive bodies arranged at respective recesses in the support member, wherein the electrically-conductive bodies protrude from the plane away from the front surface of the support member, providing a filling of molding material over the laminar support member between the at least one semiconductor die and the electrically-conductive bodies, and providing electrically-conductive lines between selected ones of the die pads of the semiconductor die and selected ones of the plurality of electrically-conductive bodies.