Invention Grant
- Patent Title: Method of mounting an electrical component on a base part
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Application No.: US16506025Application Date: 2019-07-09
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Publication No.: US10971639B2Publication Date: 2021-04-06
- Inventor: Florian Schneider , Bernd Deblitz
- Applicant: SICK AG
- Applicant Address: DE Waldkirch
- Assignee: SICK AG
- Current Assignee: SICK AG
- Current Assignee Address: DE Waldkirch
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: DE102018117695.3 20180723
- Main IPC: H01L31/024
- IPC: H01L31/024 ; H01L31/0203 ; H01L31/18

Abstract:
A method of mounting an electrical component on a base part having an inclined support surface is provided, in which method a first wedge surface of a wedge element is arranged on the support surface and a lateral force is exerted on the wedge element so that the first wedge surface moves on the support surface until a second wedge surface of the wedge element remote from the support surface reaches a desired position, and wherein the electrical component is arranged on the second wedge surface. In this respect, a first fastening element of the wedge element is fixed to the base part and the lateral force is afterward no longer exerted.
Public/Granted literature
- US20200027998A1 Method of Mounting an Electrical Component on a Base Part Public/Granted day:2020-01-23
Information query
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