Invention Grant
- Patent Title: Photonic fusing
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Application No.: US15570367Application Date: 2015-07-31
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Publication No.: US10974322B2Publication Date: 2021-04-13
- Inventor: Krzysztof Nauka , Sivapackia Ganapathiappan , Howard S Tom , Kristopher J Erickson
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/043299 WO 20150731
- International Announcement: WO2017/023285 WO 20170209
- Main IPC: B22F10/00
- IPC: B22F10/00 ; B33Y30/00 ; B33Y50/02 ; B33Y10/00 ; B22F10/10

Abstract:
Example described herein include a three-dimensional printer a threedimensional printing device that includes a fusible material applicator to apply a layer of fusible material, a inhibiting material applicator to apply a patterned layer of inhibiting material to establish exposed regions of the layer of fusible material and blocked regions of the layer of fusible material based on information corresponding to a three-dimensional model, and a photonic energy emitter to apply photonic energy to fuse the exposed regions of the layer of fusible material.
Public/Granted literature
- US20180147629A1 PHOTONIC FUSING Public/Granted day:2018-05-31
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