A method of monitoring and controlling a molding clamping apparatus in an injection molding or other molding process is disclosed. The method includes creating a target strain profile, receiving a deviation limit, receiving a change in strain relating to a mold while it is closing from a first strain gauge, identifying a deviation from a target strain profile based on the output from the first strain gauge, determining that the deviation exceeds the deviation limit, and adjusting the rate or force of clamp movement. The target strain profile may have a first portion relating to a clamp closing process, a second portion relating to a filling process, and a third portion relating to a clamp opening process. The first portion relating to the clamp closing process may include an intermediate portion relating to a coining process having an intermediate clamp force setpoint.