Invention Grant
- Patent Title: Induction heating device having improved cooling structure
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Application No.: US16678767Application Date: 2019-11-08
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Publication No.: US10980156B2Publication Date: 2021-04-13
- Inventor: Seongjun Kim , Seongho Son , Yongsoo Lee
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Fish & Richardson P.C.
- Priority: KR10-2018-0136322 20181108
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05B6/06 ; H05K5/02 ; H05B6/42

Abstract:
An induction heating device includes a case having a lower plate that defines an inlet and an exhaust slit; a cover plate coupled to the case; a working coil disposed inside the case; an indicator substrate support coupled to the lower plate and disposed below the working coil; an inverter substrate disposed on a lower surface of the indicator substrate support and including an inverter and a first heat sink configured to dissipate heat generated from the inverter; and a first blowing fan disposed at the lower plate and configured to draw air from an outside of the case through the inlet and discharge the air to the inverter substrate. The exhaust slit is configured to discharge, to an area below the lower plate, at least a portion of air discharged from the first blowing fan to the inverter substrate.
Public/Granted literature
- US20200154598A1 INDUCTION HEATING DEVICE HAVING IMPROVED COOLING STRUCTURE Public/Granted day:2020-05-14
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