- 专利标题: Electronic device having shield can structure
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申请号: US16971631申请日: 2019-02-15
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公开(公告)号: US10980158B2公开(公告)日: 2021-04-13
- 发明人: Sungyoung Lee , Changho Kim
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2018-0020678 20180221
- 国际申请: PCT/KR2019/001882 WO 20190215
- 国际公布: WO2019/164190 WO 20190829
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component. The conductive shield can structure may include: a first conductive plate including a first edge portion, a second edge portion spaced apart from the first edge portion, and a third edge portion extending between the first and second edge portions, and in top view of the one face of the printed circuit board, including a first flat portion parallel to the printed circuit board and constructing a recess together with the first to third edge portions; a second conductive plate including a fourth edge portion extending substantially parallel to the third edge portion, and in top view of the one face of the printed circuit board, including a second flat portion to be attached to the first flat part while at least partially overlapping the first flat portion; a first side portion extending along the first edge portion and substantially vertical to the first flat portion; a second side portion extending along the second edge portion and substantially vertical to the first flat portion; and a third side portion bent from the fourth edge portion while surrounding the third edge portion, and substantially vertical to the first flat portion.
公开/授权文献
- US11076512B2 Electronic device having shield can structure 公开/授权日:2021-07-27
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