Provided is a thermoplastic resin film of which adhesive force can be easily adjusted to lie within an appropriate range when the thermoplastic resin film is bonded to other members such as a glass plate. A thermoplastic resin film according to the present invention includes a thermoplastic resin, and a compound represented by the following formula (1). In the formula (1), R1, R2, R3, R4 and R5 each represent a hydrogen atom, an alkyl group, a carboxyalkyl group, a group that is a salt of a carboxyalkyl group and alkali metal, or a group that is a salt of a carboxyalkyl group and alkaline earth metal, and at least one of R1, R2, R3, R4 and R5 represents a carboxyalkyl group, a group that is a salt of a carboxyalkyl group and alkali metal, or a group that is a salt of a carboxyalkyl group and alkaline earth metal.