- Patent Title: Semiconductor device package and method of manufacturing the same
-
Application No.: US16248125Application Date: 2019-01-15
-
Publication No.: US10985149B2Publication Date: 2021-04-20
- Inventor: Chien Chan Yeh , Ying-Chih Kuo , Wei-Feng Lin
- Applicant: Omnivision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Omnivision Technologies, Inc.
- Current Assignee: Omnivision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Muncy, Geissler. Olds & Lowe, P.C.
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/31 ; H01L23/00 ; H01L23/538 ; H01L21/56
Abstract:
A semiconductor device package includes a transparent substrate, a photo detector and a first conductive layer. The transparent substrate has a first surface and a first cavity underneath the first surface. The photo detector is disposed within the first cavity. The photo detector has a sensing area facing toward a bottom surface of the first cavity of the transparent substrate. The first conductive layer is disposed over the transparent substrate and electrically connected to the photo detector.
Public/Granted literature
- US20200227394A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-07-16
Information query
IPC分类:
