Invention Grant
- Patent Title: Heat sink tray for printed circuit boards
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Application No.: US16161868Application Date: 2018-10-16
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Publication No.: US10986723B2Publication Date: 2021-04-20
- Inventor: Joshua O. Johnson , Vairavasundaram Swaminathan , Justin T. Chellew
- Applicant: INGERSOLL-RAND INDUSTRIAL U.S., INC.
- Applicant Address: US NC Davidson
- Assignee: INGERSOLL-RAND INDUSTRIAL U.S., INC.
- Current Assignee: INGERSOLL-RAND INDUSTRIAL U.S., INC.
- Current Assignee Address: US NC Davidson
- Agency: Advent, LLP
- Agent Kevin E. West
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K7/20 ; H05K3/28 ; H05K1/18
Abstract:
The present invention provides a single-piece printed circuit board heat sink and encapsulation device configured to efficiently dissipate heat away from the printed circuit board, along with associated methodology for dispersing heat from a printed circuit board.
Information query
