Invention Grant
- Patent Title: Infrared sensor chip, and infrared sensor employing same
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Application No.: US16486473Application Date: 2018-02-15
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Publication No.: US10989603B2Publication Date: 2021-04-27
- Inventor: Katsumi Kakimoto , Takafumi Okudo , Yosuke Hagihara , Akira Matsuura
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will and Emery LLP
- Priority: JPJP2017-026102 20170215,JPJP2017-039984 20170303
- International Application: PCT/JP2018/005217 WO 20180215
- International Announcement: WO2018/151200 WO 20180823
- Main IPC: G01J5/16
- IPC: G01J5/16 ; G01J5/04 ; G01J5/20

Abstract:
The disclosure has a configuration including: a supporting substrate having a cavity; at least one bridge section extending directly above the cavity and having at least one end supported by the supporting substrate and an other end; and a thermopile wiring formed in the bridge section and including hot junctions in the bridge section and cold junctions directly above the supporting substrate, the hot junctions being connected to the cold junctions. The bridge section is provided with: at least one breakage detection wiring for detecting breakage of the bridge section; and at least one heater wiring. The breakage detection wiring is wired along the thermopile wiring. The heater wiring is wired such that part of the heater wiring is in an area between the other end of the bridge section and the hot junctions.
Public/Granted literature
- US20190383666A1 INFRARED SENSOR CHIP, AND INFRARED SENSOR EMPLOYING SAME Public/Granted day:2019-12-19
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