Invention Grant
- Patent Title: Printed circuit board and package structure having the same
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Application No.: US16658288Application Date: 2019-10-21
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Publication No.: US10991647B2Publication Date: 2021-04-27
- Inventor: Yoong Oh , Sang-Hoon Kim , Hea-Sung Kim , Gyu-Mook Kim , Young-Kuk Ko
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0139039 20181113
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/00 ; H01L21/48
Abstract:
A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.
Public/Granted literature
- US20200152566A1 PRINTED CIRCUIT BOARD AND PACKAGE STRUCTURE HAVING THE SAME Public/Granted day:2020-05-14
Information query
IPC分类:
