Invention Grant
- Patent Title: Inductive connection structure for use in an integrated circuit
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Application No.: US15892467Application Date: 2018-02-09
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Publication No.: US10991654B2Publication Date: 2021-04-27
- Inventor: Alberto Pagani
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Priority: ITVI2010A000341 20101220
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01J17/00 ; H01L23/522 ; H01L23/66 ; G01R31/302 ; G01R31/315
Abstract:
A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.
Public/Granted literature
- US20180174964A1 INDUCTIVE CONNECTION STRUCTURE FOR USE IN AN INTEGRATED CIRCUIT Public/Granted day:2018-06-21
Information query
IPC分类:
