Invention Grant
- Patent Title: Semiconductor device package
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Application No.: US16446368Application Date: 2019-06-19
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Publication No.: US10991656B2Publication Date: 2021-04-27
- Inventor: Chang-Lin Yeh , Jen-Chieh Kao
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/538 ; H01L25/16 ; H01L23/498 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor device package includes a first substrate, a second substrate disposed over the first substrate, and a surface mount device (SMD) component disposed between the first substrate and the second substrate. The SMD component includes a plurality of connection electrodes electrically connecting the first substrate to the second substrate, and the plurality of connection electrodes are electrically disconnected from each other.
Information query
IPC分类:
