Invention Grant
- Patent Title: Resin composition and applications thereof
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Application No.: US16332586Application Date: 2017-09-13
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Publication No.: US10995189B2Publication Date: 2021-05-04
- Inventor: Edgard Chow , Kentaro Yoshida , Tatsuya Hasegawa
- Applicant: KURARAY CO., LTD.
- Applicant Address: JP Kurashiki
- Assignee: KURARAY CO., LTD.
- Current Assignee: KURARAY CO., LTD.
- Current Assignee Address: JP Kurashiki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/033016 WO 20170913
- International Announcement: WO2018/052014 WO 20180322
- Main IPC: C08K5/13
- IPC: C08K5/13 ; C08K5/3435 ; C08J5/18 ; C08J3/22 ; A01G13/02 ; A01F25/13 ; A01F25/14 ; F16L9/12 ; A01G9/14 ; A01M13/00 ; E02D17/20 ; E02D31/00

Abstract:
A resin composition contains an ethylene-vinyl alcohol copolymer (A) in which an ethylene unit content is from 10 to 60 mol %, a hindered amine-based compound (B) having a 2,2,6,6-tetraalkylpiperidine ring structure and having an alkoxy group bonded to a nitrogen atom in the structure, and a hindered phenol-based compound (C) having an ester bond or an amide bond. The resin composition contains 0.1 to 5 parts by mass of the hindered amine-based compound (B) and 0.2 to 5 parts by mass of the hindered phenol-based compound (C) with respect to 100 parts by mass of the ethylene-vinyl alcohol copolymer (A), and a mass ratio (C)/(B) is from 0.2 to 3.6.
Public/Granted literature
- US20200291197A1 RESIN COMPOSITION AND APPLICATIONS THEREOF Public/Granted day:2020-09-17
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