Invention Grant
- Patent Title: Sensor
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Application No.: US16473212Application Date: 2017-12-20
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Publication No.: US10996181B2Publication Date: 2021-05-04
- Inventor: Hyunchul Kim , Myungwon Lee
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2017-0154814 20171120
- International Application: PCT/KR2017/015121 WO 20171220
- International Announcement: WO2018/131818 WO 20180719
- Main IPC: G01N27/12
- IPC: G01N27/12 ; B41F13/11 ; B41F15/06 ; H01Q1/22 ; H01Q1/36 ; H01Q1/38 ; G01N33/03

Abstract:
Provided is a sensor comprising a non-conductive substrate; and a conductive layer electronically printed on one side of the substrate, wherein the conductive layer comprises: an antenna pattern for transmitting and receiving a radio signal with an external device; a sensing electrode connected to the antenna pattern via a circular wiring for sensing an impedance change due to contact with a sensing target material; and a coating electrode stacked on the sensing electrode for removing an occurrence of noise of the impedance change. Accordingly, the present invention solves the problem of a sensor, in the form of a terminal, not being compact and the problem of high manufacturing costs and low manufacturing quality of a sensor manufactured using a deposition method in order to replace such sensor with a sensor manufactured by a printing method, and solves a corrosion problem of a sensing electrode, a durability problem, etc. that may occur in the sensor of the printing method.
Public/Granted literature
- US20190331623A1 SENSOR Public/Granted day:2019-10-31
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