Invention Grant
- Patent Title: Device including a vertical transistor having a large band gap channel material and void spaces adjacent gate electrodes, and related methods and systems
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Application No.: US16596407Application Date: 2019-10-08
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Publication No.: US10998440B2Publication Date: 2021-05-04
- Inventor: Kamal M. Karda , Ramanathan Gandhi , Hong Li , Haitao Liu , Durai Vishak Nirmal Ramaswamy , Sanh D. Tang , Scott E. Sills
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/66

Abstract:
A device comprises a vertical transistor. The vertical transistor comprises a semiconductive pillar, at least one gate electrode, a gate dielectric material, and void spaces. The semiconductive pillar comprises a source region, a drain region, and a channel region extending vertically between the source region and the drain region, the channel region comprising a semiconductive material having a band gap greater than 1.65 electronvolts. The at least one gate electrode laterally neighbors the semiconductive pillar. The gate dielectric material is laterally between the semiconductive pillar and the at least one gate electrode. The void spaces are vertically adjacent the gate dielectric material and laterally intervening between the at least one gate electrode and each of the source region and the drain region of the semiconductive pillar. Related electronic systems and methods are also disclosed.
Information query
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