Invention Grant
- Patent Title: Production method of mold, manufacturing method of pattern sheet, production method of electroform, and production method of mold using electroform
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Application No.: US15933573Application Date: 2018-03-23
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Publication No.: US11007678B2Publication Date: 2021-05-18
- Inventor: Shotaro Ogawa , Satoshi Chai , Kenji Ichikawa , Kazunori Komatsu , Kozue Ikeda , Ryo Hibino
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2015-193480 20150930,JPJP2016-097825 20160516
- Main IPC: B29C33/38
- IPC: B29C33/38 ; B29C33/42 ; B81C99/00 ; A61M37/00 ; B29C43/52 ; B29C33/40 ; B29C41/20 ; B29C41/38 ; B29C41/42 ; C25D1/10 ; B29K101/12 ; B29L7/00 ; B29L31/00

Abstract:
A production method of a mold includes: preparing a plate precursor having a protruding pattern formed of protrusions in a pattern presence region on a base, and a thermoplastic resin sheet; determining a position at which the plate precursor is to be pressed against the thermoplastic resin sheet by moving the plate precursor and the thermoplastic resin sheet relative to each other; and forming a recessed pattern on the thermoplastic resin sheet by pressing the protrusions of the plate precursor which is heated against the thermoplastic resin sheet at a position where a part of the pattern presence region of the plate precursor excluding the protrusions is separated from a surface of the thermoplastic resin sheet, cooling the plate precursor in a state in where the pressed protrusions and the thermoplastic resin sheet are in contact with each other, and separating the plate precursor from the thermoplastic resin sheet.
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