- 专利标题： Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
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申请号： US16960181申请日： 2019-01-08
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公开(公告)号： US11008420B2公开(公告)日： 2021-05-18
- 发明人: Masahiko Shigaki , Kentaro Takano
- 申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址： JP Tokyo
- 代理机构： Renner, Kenner
- 代理商 Arthur M. Reginelli
- 优先权： JPJP2018-001490 20180109
- 国际申请： PCT/JP2019/000176 WO 20190108
- 国际公布： WO2019/138992 WO 20190718
- 主分类号： C08G65/48
- IPC分类号： C08G65/48 ; B32B15/08 ; C08J5/24 ; C08L35/08 ; H05K1/03
摘要：
Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C): wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1