发明授权
- 专利标题: Apparatus and method for arranging antennas supporting millimeter wave frequency bands
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申请号: US16383812申请日: 2019-04-15
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公开(公告)号: US11011828B2公开(公告)日: 2021-05-18
- 发明人: Jungmin Park , Chih Wei Lee , Chonghwa Seo , Sungcheol Yoo , Jongwon Lee
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Cha & Reiter, LLC.
- 优先权: KR10-2018-0043544 20180413
- 主分类号: H01Q1/24
- IPC分类号: H01Q1/24 ; H01Q21/30 ; H01Q21/06
摘要:
Disclosed is an electronic device. The electronic device comprises a housing forming an exterior of the electronic device, and including a front surface, a back surface facing away from the front surface, and a side surface substantially perpendicular to the front surface and the back surface; a first conductive plate positioned towards the back surface having a first antenna array disposed on the first conductive plate, the first antenna array configured to radiate a signal in a first frequency band toward the back surface; a second antenna array connected to the conductive plate, the second antenna array configured to radiate a signal in a second frequency band at least partially different from the first frequency band toward the side surface, and having an antenna element at least partially different from the first antenna array, a second conductive plate positioned towards the side surface having a third antenna array disposed on the second conductive plate, the third antenna array configured to radiate the signal in the second frequency band toward the side surface, and a fourth antenna array connected to the second conductive plate and configured to radiate the signal in the first frequency band toward the back surface.
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