Invention Grant
- Patent Title: Display device, circuit bonding structure, and circuit bonding method
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Application No.: US16301397Application Date: 2018-03-22
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Publication No.: US11013121B2Publication Date: 2021-05-18
- Inventor: Zhifu Yang , Zhiyang Cui , Dahua Zhu , Lei Zhao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing; CN Hebei
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing; CN Hebei
- Agency: Arch & Lake LLP
- Priority: CN201710412978.2 20170605
- International Application: PCT/CN2018/080083 WO 20180322
- International Announcement: WO2018/223750 WO 20181213
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30

Abstract:
The present disclosure relates to a circuit bonding structure, a circuit bonding method, and a display device. The circuit bonding structure includes a carrying portion configured to carry a driving circuit and having two sides which are adjacent to each other and form a preset acute angle and a preset circuit board having a bonding region having two sides which are adjacent to each other and form a preset acute angle. The driving circuit is bonded to the bonding region by the carrying portion.
Public/Granted literature
- US20210022251A1 DISPLAY DEVICE, CIRCUIT BONDING STRUCTURE, AND CIRCUIT BONDING METHOD Public/Granted day:2021-01-21
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