A lamination molding apparatus, includes a material layer former to form a material layer; a first emitter to form a solidified layer by irradiating the material layer with a first beam; and a thermal adjuster to adjust a temperature of at least a portion of the solidified layer to at least one of a predetermined first temperature and a predetermined second temperature. The temperature of at least the portion of the solidified layer is adjusted to the first temperature, and then to the second temperature. When the first temperature is referred to as T1, the second temperature is referred to as T2, a martensite start temperature of the solidified layer is referred to as Ms, and a martensite finish temperature of the solidified layer is referred to as Mf, all of the following relations of T1≥Mf, T1>T2, and T2≤Ms are satisfied.