Invention Grant
- Patent Title: Method for forming semiconductor device structure having oxide layer
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Application No.: US16035159Application Date: 2018-07-13
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Publication No.: US11018022B2Publication Date: 2021-05-25
- Inventor: I-Ming Chang , Chih-Cheng Lin , Chi-Ying Wu , Wei-Ming You , Ziwei Fang , Huang-Lin Chao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/335
- IPC: H01L21/335 ; H01L21/8232 ; H01L21/425 ; H01L21/322 ; H01L21/28 ; H01L29/78 ; H01L21/762 ; H01L29/165 ; H01L29/66

Abstract:
A method for forming a semiconductor device structure is provided. The method includes depositing a gate dielectric layer over a substrate. The substrate has a base portion and a first fin portion over the base portion, and the gate dielectric layer is over the first fin portion. The method includes forming a gate electrode layer over the gate dielectric layer. The gate electrode layer includes fluorine. The method includes annealing the gate electrode layer and the gate dielectric layer so that fluorine from the gate electrode layer diffuses into the gate dielectric layer.
Public/Granted literature
- US20200020544A1 METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE HAVING OXIDE LAYER Public/Granted day:2020-01-16
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