Invention Grant
- Patent Title: Substrate processing apparatus including edge ring
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Application No.: US16559762Application Date: 2019-09-04
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Publication No.: US11018046B2Publication Date: 2021-05-25
- Inventor: Jong Woo Sun , Sung Moon Park , Je Woo Han , Kwang Nam Kim , Ho Chang Lee , Young Hoon Jeong , Masayuki Tomoyasu
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2019-0043250 20190412,KR10-2019-0056599 20190514
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; H01J37/32

Abstract:
A substrate processing apparatus including a process chamber; a susceptor in the process chamber; and an inner edge ring and an outer edge ring on the susceptor, wherein the inner edge ring includes a semiconductor, the outer edge ring includes an insulator, an upper surface of the outer edge ring is at a higher level than an upper surface of the inner edge ring, and the outer edge ring has an overhang extending onto the inner edge ring.
Public/Granted literature
- US20200328105A1 SUBSTRATE PROCESSING APPARATUS INCLUDING EDGE RING Public/Granted day:2020-10-15
Information query
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