Invention Grant
- Patent Title: Wafer level derived flip chip package
-
Application No.: US16423104Application Date: 2019-05-27
-
Publication No.: US11018111B2Publication Date: 2021-05-25
- Inventor: Rongwei Zhang , James Huckabee , Vikas Gupta
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L23/544 ; H01L21/304 ; H01L21/48 ; H01L21/56 ; H01L21/78
Abstract:
A leadless integrated circuit (IC) package includes a spaced apart plurality of lead terminals on at least two sides of the leadless IC package, and an IC die including a substrate having at least a semiconductor surface including circuitry coupled to bond pads with the bond pads having bonding features thereon. The bonding features are flip chip bonded to the plurality of lead terminals. Mold compound is above the IC die and between adjacent lead terminals. The lead terminals and the substrate both extend out to have exposed surfaces at edges of the leadless IC package, and the lead terminals also provide a back side bondable contact.
Public/Granted literature
- US20200381390A1 WAFER LEVEL DERIVED FLIP CHIP PACKAGE Public/Granted day:2020-12-03
Information query
IPC分类:
