- 专利标题： Method of manufacturing conductive film holes
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申请号： US16574580申请日： 2019-09-18
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公开(公告)号： US11022039B2公开(公告)日： 2021-06-01
- 发明人: Kevin L. Zacchera , Thomas N. Slavens
- 申请人： United Technologies Corporation
- 申请人地址： US CT Farmington
- 专利权人： United Technologies Corporation
- 当前专利权人： United Technologies Corporation
- 当前专利权人地址： US CT Farmington
- 代理机构： Bachman & LaPointe, P.C.
- 主分类号： C23C4/01
- IPC分类号： C23C4/01 ; F02C7/18 ; F23R3/00 ; F01D5/18 ; F01D5/28 ; C23C14/04
摘要：
A method for applying a coating to a substrate having a plurality of holes. The method comprises: applying a braze material to a substrate having a plurality of holes; heating the substrate to melt the braze material to form a melt; cooling the substrate to solidify the melt to form plugs in the respective holes; applying a coating to the substrate; and further heating the substrate to melt the plugs.
公开/授权文献
- US20200025085A1 Method of Manufacturing Conductive Film Holes 公开/授权日：2020-01-23
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