- 专利标题： Manufacturing method of device chip
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申请号： US16704334申请日： 2019-12-05
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公开(公告)号： US11024542B2公开(公告)日： 2021-06-01
- 发明人: Heidi Lan
- 申请人： DISCO CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： DISCO CORPORATION
- 当前专利权人： DISCO CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Greer Burns & Crain Ltd.
- 优先权： JPJP2018-229006 20181206
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L23/00 ; H01L21/268 ; H01L21/3065 ; H01L21/304
摘要：
A manufacturing method of a device chip includes a die bonding resin providing step of supplying a die bonding resin in a liquid state to a back surface side of a wafer with device chips formed on a front surface thereof and solidifying the die bonding resin, a water-soluble resin providing step of covering the die bonding resin with a water-soluble resin, a laser processing step of applying a laser beam from the back surface side of the wafer to remove the die bonding resin and the water-soluble resin, an etching step of etching an exposed portion on the back surface side of the wafer to divide the wafer, and a water-soluble resin removing step of supplying water on the back surface side of the wafer to remove the water-soluble resin.
公开/授权文献
- US20200185275A1 MANUFACTURING METHOD OF DEVICE CHIP 公开/授权日：2020-06-11
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