Invention Grant
- Patent Title: Housing for receiving electronic devices and electronic system having the same
-
Application No.: US16444499Application Date: 2019-06-18
-
Publication No.: US11026355B2Publication Date: 2021-06-01
- Inventor: Hee-Won Kang , Nam-Su Kim , In-Hyuk Ko , Eun-Ji Moon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0163945 20181218
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K9/00 ; H05K1/02 ; H05K5/02 ; H05K1/18

Abstract:
Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.
Information query