Invention Grant
- Patent Title: Package panel processing with integrated ceramic isolation
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Application No.: US16263110Application Date: 2019-01-31
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Publication No.: US11031332B2Publication Date: 2021-06-08
- Inventor: Woochan Kim , Benjamin Allen Samples , Vivek Kishorechand Arora
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/522 ; H01L23/538 ; H01L23/532 ; H01L25/07 ; H01L49/02 ; H01L23/00 ; H01L25/00
Abstract:
A packaged electronic device includes a semiconductor die with an electronic component and a contact structure connected to the electronic component, as well as an organic panel frame, a lamination structure that partially embeds the semiconductor die in an opening of the organic panel frame, and a ceramic substrate mounted to a first side of the semiconductor die.
Public/Granted literature
- US20200251415A1 PACKAGE PANEL PROCESSING WITH INTEGRATED CERAMIC ISOLATION Public/Granted day:2020-08-06
Information query
IPC分类:
