- 专利标题: Imaging element, stacked imaging element, and solid-state imaging device
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申请号: US16499916申请日: 2018-02-20
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公开(公告)号: US11037979B2公开(公告)日: 2021-06-15
- 发明人: Fumihiko Koga
- 申请人: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 申请人地址: JP Kanagawa
- 专利权人: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人地址: JP Kanagawa
- 代理机构: Sheridan Ross P.C.
- 优先权: JPJP2017-078236 20170411
- 国际申请: PCT/JP2018/005955 WO 20180220
- 国际公布: WO2018/189999 WO 20181018
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
An imaging element has at least a photoelectric conversion section, a first transistor TR1, and a second transistor TR2, the photoelectric conversion section includes a photoelectric conversion layer, a first electrode, and a second electrode, the imaging element further has a first photoelectric conversion layer extension section, a third electrode, and a fourth electrode, the first transistor TR1 includes the second electrode that functions as one source/drain section, the third electrode that functions as a gate section, and the first photoelectric conversion layer extension section that functions as the other source/drain section, and the first transistor TR1 (TRrst) is provided adjacent to the photoelectric conversion section.
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