- 专利标题： Method for selectively depositing a conductive coating over a patterning coating and device including a conductive coating
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申请号： US16613779申请日： 2018-05-17
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公开(公告)号： US11043636B2公开(公告)日： 2021-06-22
- 发明人: Michael Helander , Zhibin Wang , Jacky Qiu
- 申请人： OTI Lumionics Inc.
- 申请人地址： CA Toronto
- 专利权人： OTI Lumionics Inc.
- 当前专利权人： OTI Lumionics Inc.
- 当前专利权人地址： CA Toronto
- 代理机构： Foley & Lardner LLP
- 国际申请： PCT/IB2018/053499 WO 20180517
- 国际公布： WO2018/211460 WO 20181122
- 主分类号： H01L51/00
- IPC分类号： H01L51/00 ; H01L51/52
摘要：
A device includes: (1) a substrate; (2) a patterning coating covering at least a portion of the substrate, the patterning coating including a first region and a second region; and (3) a conductive coating covering the second region of the patterning coating, wherein the first region has a first initial sticking probability for a material of the conductive coating, the second region has a second initial sticking probability for the material of the conductive coating, and the second initial sticking probability is different from the first initial sticking probability.
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