- 专利标题： Method for assembling an electronic device
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申请号： US16131137申请日： 2018-09-14
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公开(公告)号： US11051415B2公开(公告)日： 2021-06-29
- 发明人: Sheng-Wen Wu , Yu-Cheng Huang , Ke-Hua Lin , Shao-Chi Chuang , Wen-Shu Lee
- 申请人： Acer Incorporated
- 申请人地址： TW New Taipei
- 专利权人： Acer Incorporated
- 当前专利权人： Acer Incorporated
- 当前专利权人地址： TW New Taipei
- 代理机构： McClure, Qualey & Rodack, LLP
- 优先权： TW104129125 20150903
- 主分类号： H05K5/02
- IPC分类号： H05K5/02 ; H05K5/00
摘要：
A method for assembling the electronic device is provided, including providing a band member, forming a buffer structure on the band member by overmolding, pulling the band member out of the buffer structure to form a channel in the buffer structure, providing a flexible circuit, and disposing the flexible circuit through the channel.
公开/授权文献
- US20190014673A1 ELECTRONIC DEVICE AND ASSEMBLY METHOD THEREOF 公开/授权日：2019-01-10
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