- 专利标题: Electronic device including thin housing, and manufacturing method therefor
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申请号: US16779950申请日: 2020-02-03
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公开(公告)号: US11051416B2公开(公告)日: 2021-06-29
- 发明人: Seung Chang Baek , Hyeong Sam Son , Chang Jin Song , Chang Hyeok Shin , Sung Ho Cho , Chong Kun Cho , Han Gyu Hwang , Min Woo Yoo
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Jefferson IP Law, LLP
- 优先权: KR10-2017-0031395 20170313
- 主分类号: H05K5/02
- IPC分类号: H05K5/02 ; H05K5/00 ; H05K5/04 ; H01Q1/22 ; C25D11/02 ; H04M1/02 ; C25D11/00 ; C25D17/06 ; C25D11/04 ; H01Q1/24 ; H04B1/3827 ; G06F1/16 ; C25D11/16 ; H01Q13/10
摘要:
An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.
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