Invention Grant
- Patent Title: Subfloor assembly on a support substrate
-
Application No.: US17067200Application Date: 2020-10-09
-
Publication No.: US11053697B2Publication Date: 2021-07-06
- Inventor: Erlin A. Randjelovic
- Applicant: Erlin A. Randjelovic
- Applicant Address: US MI Crystal Falls
- Assignee: Erlin A. Randjelovic
- Current Assignee: Erlin A. Randjelovic
- Current Assignee Address: US MI Crystal Falls
- Agency: Epiphany Law, LLC
- Main IPC: E04F15/22
- IPC: E04F15/22 ; E04F15/04

Abstract:
A subfloor assembly that supports a flooring section on a substrate. The subfloor assembly includes a subfloor section and a resilient component. The subfloor section includes an offset groove in an underside of the subfloor section. The offset groove is defined by a side of the groove spaced apart from an opposing side of the groove and a ceiling spanning between the side and the opposing side and sloped relative to an upper surface of the substrate. The resilient component is positioned in the offset groove and between the ceiling and the upper surface of the substrate.
Public/Granted literature
- US20210115682A1 SUBFLOOR ASSEMBLY ON A SUPPORT SUBSTRATE Public/Granted day:2021-04-22
Information query