- 专利标题： Process monitor for wafer thinning
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申请号： US16119543申请日： 2018-08-31
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公开(公告)号： US11056351B2公开(公告)日： 2021-07-06
- 发明人: Stephen L. Morein
- 申请人： Synaptics Incorporated
- 申请人地址： US CA San Jose
- 专利权人： Synaptics Incorporated
- 当前专利权人： Synaptics Incorporated
- 当前专利权人地址： US CA San Jose
- 代理机构： Paradice & Li LLP
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L21/321 ; B24B49/10 ; H01L21/683
摘要：
A system and method for thinning an integrated circuit (IC) wafer. The system includes a support structure to hold the IC wafer and a mechanism to operate on the IC wafer. The support structure includes one or more inductive coils configured to transmit a power signal to the IC wafer and receive a feedback signal from the IC wafer. The system further includes a process controller to control the operation based at least in part on the feedback signal received from the IC wafer.
公开/授权文献
- US20200075345A1 PROCESS MONITOR FOR WAFER THINNING 公开/授权日：2020-03-05
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