A substrate holding apparatus includes a baseplate, an adhesive layer disposed on the baseplate, and an electrostatic chuck disposed on the adhesive layer to hold an object, wherein a first side surface of a first portion of the electrostatic chuck is at a same position in a plan view as a second side surface of a second portion of the baseplate, the first portion being in contact with a first face of the adhesive layer, the second portion being in contact with a second face of the adhesive layer, wherein the adhesive layer has a protruding part extending outwardly from the first side surface and the second side surface, and wherein the first face and the second face are flat planes extending from an inside of the first side surface and the second side surface to an outside of the first side surface and the second side surface.